Tape-out流片
Tape-out is the stage in an integrated circuit design project when the final verified layout database is submitted to a foundry so that mask making and wafer fabrication can begin. In design-cycle documentation, milestone reports, and foundry communication, 'tape-out' marks the handoff from design engineering to manufacturing and is often used as a schedule anchor even though silicon is not yet available.
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Where this term appears
'Tape-out' appears in project schedules, design review minutes, foundry checklists, product development updates, technology transfer documents, and investor or customer roadmaps. Localizers encounter it when translating milestone decks, tape-out criteria, and new product introduction material, where it must be kept distinct from actual wafer output, first silicon, or volume production.
Translation checks
A common error is using literal, outdated phrases such as 'tape output' or treating tape-out as the moment chips are finished. In project and foundry documents, that creates false scheduling expectations. Another pitfall is inconsistent terminology across timelines, such as mixing 'tape-out' and 'release to manufacturing' without noting that mask and wafer processing still remain.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
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SMIC (Semiconductor Manufacturing International)
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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