Translate semiconductor datasheets, EDA documentation, process-design-kit guides and patent materials for Chinese readers. Keep technical terms, values and document references connected across the file set.
Tell us what the documents are for, which source revision to use and who will read the translation.
Datasheets, application notes, PDK guides and test reports.
EDA tool documentation and related technical whitepapers.
Patent filings and corporate reporting — scoped as distinct projects.
| Parameter | Symbol | Condition | Unit |
|---|---|---|---|
| Input voltage | VIN | Retained | V |
| Supply current | ICC | Retained | mA |
Symbols, units, conditions and footnote references stay connected.
These published cases describe the work delivered. Corporate disclosure work and technical specifications are different project types.
SMIC (Semiconductor Manufacturing International)Corporate reporting and disclosure documentation, delivered across successive annual cycles.
English ⇄ ChineseRead project details →Technical specification for a custom LTE chipset.
Chinese ⇄ EnglishRead project details →
Suzhou GCL TechnologyPortuguese-language documentation for a national semiconductor industry programme.
Portuguese → ChineseRead project details →
Torex SemiconductorJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Japanese → ChineseRead project details →
Genmark AutomationEnglish-to-Chinese company and product website text, including software-solution descriptions.
English → ChineseRead project details →A datasheet, a process design kit guide and a patent filing often describe the same structure. When each is translated separately, the same term arrives three different ways — creating engineering ambiguity downstream and weakening the language of a claim.
Deciding whether a term is used correctly in a specific process or device context is an engineering judgement, not a linguistic one. Fluent output that is technically wrong is the most expensive kind of error, because it reads as correct.
Process details, device specifications and pre-announcement material move through whoever handles the translation. Confidentiality is a structural requirement of the workflow, not a clause at the end of it.
Compare the preparation guide and the recorded project scope, then tell us which files you need in Chinese. Select your actual source language in the inquiry form.
Retain clause identities, symbols and source changes in a reviewable Chinese version.
Preparation guide →Chinese–English custom chipset specification work; read the case for its recorded scope.
For datasheets, plan checks on values, conditions and units using the existing preparation guide.
Preparation guide →Torex Semiconductor →Japanese-to-Chinese semiconductor documentation. The case does not identify a specific datasheet assignment.
Align reporting periods, entity names and repeated disclosures; keep this scope separate from device specifications.
Preparation guide →SMIC (Semiconductor Manufacturing International) →English–Chinese corporate reporting and disclosure documentation across successive annual cycles.
For a quote, include the source files, language direction, intended use and required date. Discuss your project →
Selected bilingual references. The full terminology glossary remains available below.
Acknowledged in 4 hours, quoted in 24. Discuss confidentiality before sharing sensitive files.