Die裸片
A die is an individual integrated circuit unit separated from a finished wafer after dicing, containing the functional circuitry before it is placed into a package. In semiconductor production and quality documentation, the term appears in wafer maps, die-level test data, failure analysis reports, and assembly instructions, where it must be distinguished from both the wafer and the packaged chip.
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Where this term appears
'Die' occurs in wafer probe reports, yield maps, packaging design, die-attach process descriptions, package outline drawings, and failure analysis documentation. Translators must handle it when localizing assembly instructions, known-good-die specifications, and defect location images, where the word is often rendered as '裸片' or '管芯' depending on the technical audience.
Translation checks
A common error is translating 'die' as 'chip' in contexts that require the unpackaged unit, especially in die-level process steps. This makes assembly and test documents ambiguous, particularly when describing die-attach, wire-bond, or known-good-die flows. Another issue is confusing singular and plural usage because 'die' is both singular and plural in the industry.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
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SMIC (Semiconductor Manufacturing International)
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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