Package封装
A package is the protective enclosure that surrounds a semiconductor die, provides electrical connections from the die to a circuit board or substrate, and removes heat generated during operation. In translated materials, the term appears in assembly drawings, datasheets, bill-of-material entries, and reliability tests that specify package type, lead count, body size, moisture sensitivity level, and overall thermal dissipation path.
Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.
Check source meaning → confirm the preferred term → record approved variants and references.
Where this term appears
In localization projects, the term package occurs in component datasheets, assembly instructions, solder reflow profiles, tray and tape-and-reel labels, and reliability qualification reports. It is also common in ERP or PLM item descriptions and in failure analysis documents where package-level defects such as cracks or delamination must be separated from die-level defects.
Translation checks
The most common error is translating package as “packaging” or “software package” when the source refers to the physical component enclosure. This mistake appears in BOMs and assembly guides, where it can cause confusion with shipping materials or software installation units rather than the mounted semiconductor part that is placed on the board.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
Prepare an inquiry email →Semiconductor solutions →File handling →A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.