Wire Bond引线键合
Wire bonding is an interconnection process that uses fine metal wire, usually gold, copper, or aluminum, to connect die pads to package leads or substrate fingers after die attach. In localization, the term appears in packaging process specifications, assembly drawings, bond diagrams, quality inspection documents, and reliability reports that describe first-level interconnect and its effect on electrical performance.
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Where this term appears
Localization teams encounter wire bonding in assembly process documentation, bond pad layout notes, and package qualification reports. Strings such as 'wire loop', 'ball bond', 'wedge bond', and 'wire sweep' need careful handling in diagrams, machine alarm messages, and inspection criteria. The term also appears in supplier quality manuals that set limits on missing or lifted bonds.
Translation checks
A common mistake is translating wire-bond as 'wire connection' or 'cable tie', importing generic electrical or mechanical language. In packaging, the term refers to a specific microscopic bonding process, so a generic phrase obscures the distinction from solder or adhesive interconnects. Another error is confusing 'wire' with PCB wiring; translators should keep the die-and-package context and avoid generic 'line connection' wording.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
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SMIC (Semiconductor Manufacturing International)
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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