Wire Sweep引线偏移
Wire sweep is a packaging defect in which bond wires are displaced from their intended loop shape during mold compound flow, potentially causing wire shorts or opens. In translated documents, it appears in wire-bond process specifications, molding process optimization reports, failure analysis studies, reliability qualification documents, and mold flow simulation reports that examine flow-induced stress, wire deformation, and loop-height loss.
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Where this term appears
Translators encounter wire-sweep in assembly defect summaries, molding simulation reports, and corrective action documents. It often appears with measurements such as sweep percentage and rejection limits. Because the term is specific to the molding step, translating it as general wire displacement without the mold flow context weakens the technical meaning in failure analysis.
Translation checks
A frequent mistake is translating wire-sweep as '线扫' or '线偏移' without the packaging context, making it sound like a scanning action or general movement. This can confuse readers of molding process documents, where the term is a specific defect mode. It may also be confused with wire-bond, the process step, obscuring defect root causes.
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