Assembly组装
In semiconductor packaging, assembly is the process of mounting a die into a package, connecting its pads to the package leads or substrate, and sealing it into a finished component. In localization, the term appears in packaging specifications, assembly drawings, process flow documents, reliability reports, and subcontractor instructions that describe manufacturing steps after wafer dicing; it usually excludes board-level assembly of electronic systems.
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Where this term appears
Localization teams see assembly in packaging datasheets, assembly design rules, production travelers, and supplier quality agreements. The term is used during translation of diagrams and notes in assembly instructions, where terms like die attach, wire bond, molding, and singulation must remain distinct. It also appears in ERP work orders that track the transition from wafer to packaged component.
Translation checks
A common error is translating assembly generically as 'installation' or 'fitting' without narrowing it to packaging. In semiconductor documents this creates ambiguity with board-level assembly or installation, especially when the source sentence discusses both package assembly and final system assembly. Another mistake is treating 'assemble' as 'assembly' while rendering related steps inconsistently, such as reusing the same term for die attach, wire bond, and molding.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
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