Die Attach芯片粘接
Die attach is the packaging operation in which a singulated semiconductor die is mechanically and thermally bonded to a substrate, lead frame, or package base using epoxy, solder, or adhesive film. It appears in assembly process flows, work instructions, bill-of-materials descriptions, and reliability or failure-analysis reports where bond material and die placement are recorded; the term is common in packaging and assembly documentation rather than front-end wafer processing content.
Updated
Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.
Check source meaning → confirm the preferred term → record approved variants and references.
Where this term appears
In localization, die attach appears in assembly and packaging work instructions, machine manuals for die bonders, process specifications, and quality inspection forms. It is also used in training courses for operators and in supplier datasheets that describe adhesives, solder preforms, or film materials. Translators often encounter it in English source from OSATs and packaging equipment vendors; in wire-bonded package descriptions, die attachment and the later wire-bond interconnection are separate steps.
Translation checks
A frequent error is translating die attach with a generic term like 'die installation' or 'chip mounting,' which hides the specific bonding process and the required adhesive or solder interface. Another is conflating die attachment with wire bonding. Suppliers may use die attach and die bonding for the attachment step; keep that step distinct from the wire interconnection and follow the source's terminology.
From reading to a project
Keep die placement and electrical interconnection as separate document concepts
Illustrative file reference · invented DEMO documents
- File and revision
- DEMO-PKG-01 · Assembly overview · Rev C
- Named step and item
- Die attach · die / substrate / package-base labels
- Related drawing references
- DEMO-FIG-02 · attachment callout ↔ matching parts list
- Illustrative Chinese reference
- 装配概述 · DEMO-PKG-01 · C版
Review status: questions to confirm
Separate die attach from wire bonding
When both appear in a flow or drawing, preserve die attach as the die-to-carrier attachment step and wire bonding as a distinct electrical interconnection. Check that labels and sequence references do not collapse the two.
Resolve shortened bond labels from context
If a source uses “die bond,” check nearby material, drawing and process labels before choosing the approved Chinese term. Query an incomplete label instead of treating it as a new or different process.
Match material names to the file field
Keep adhesive, solder, paste, and film distinct when they occur as material or BOM labels. Do not infer a material from the term “die attach” alone; align the translated label with the exact source field and approved terminology.
Related published experience
Torex SemiconductorJapanese → Chinese
Japanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Related Japanese-to-Chinese semiconductor documentation for Torex. The invented register illustrates file preparation; the public case does not identify this particular process or document set.
List the files, source revisions, material and part labels, drawing references, intended Chinese readers, review owner and translated file format.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Working on semiconductor documentation?
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
Prepare a Chinese semiconductor-file inquiry →Semiconductor solutions →File handling →A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.