In semiconductor manufacturing, yield is the ratio of functional dies or wafers that pass electrical and reliability screens to the total number fabricated under a given process, often reported for wafer sort, assembly, or final test. The term appears throughout production documentation, including wafer probe reports, defect-density analyses, binning summaries, yield-learning reviews, and cost models, where it serves as a key process-health and economic indicator.
Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.
Check source meaning → confirm the preferred term → record approved variants and references.
'Yield' appears in foundry reports, test engineering documentation, product qualification decks, supply-chain summaries, and cost-review presentations. Localizers handle it when translating wafer-sort data, yield-by-die maps, excursion reports, and manufacturing KPI dashboards, where the word must remain '良率' rather than more general '产出' or '收益' in semiconductor contexts. Misreading this term as production output can distort quality conclusions.
A common error is translating 'yield' as 'output' or 'return' in manufacturing contexts, which obscures whether the metric measures quality or volume. Another issue is not distinguishing between wafer yield, die yield, and final test yield, especially in reports where different screens remove different portions of the population and each ratio must be labeled precisely.
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Japanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →Corporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
Prepare an inquiry email →Semiconductor solutions →File handling →A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.