Chip Scale Package芯片级封装
A chip scale package is a surface-mount package whose total footprint is only slightly larger than the semiconductor die itself, often defined as no more than 1.2 times the die area. In translation and localization, the term appears in package datasheets, component datasheets, assembly guidelines, and reliability standards that describe land pattern design, solder joint stress, board-level reliability, and thermal cycling performance.
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Where this term appears
Translators see chip-scale-package in component library data, PCB footprint guidelines, and solder stencil recommendations. It may appear as CSP in source text, and the expansion must be handled carefully because CSP can also stand for chip-size package. Consistency in translated CAD library notes and inspection documents helps avoid footprint errors.
Translation checks
A common mistake is translating chip-scale-package as '芯片尺寸封装' in every context and ignoring the industry convention that distinguishes chip-scale from chip-size. In PCB design documents, this can confuse footprint selection because the two terms may imply different package outlines and design rules, leading to land pattern mismatches.
Keep the term aligned across your files
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Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
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