English–Chinese reference · Semiconductor

Known Good Die已知合格裸片

A known good die is an unpackaged semiconductor die that has been tested and verified to meet electrical specifications before being assembled into a package or module. In translation and localization, the term appears in procurement specifications, assembly work instructions, quality agreements, multi-chip module design documents, supply-chain traceability records, and documentation for stacked-die or heterogeneous integration projects and final system assembly flows.

Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.

TERM REFERENCE · PROJECT CHECK
EnglishKnown Good Die
Chinese (Simplified)已知合格裸片
DomainSemiconductor

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Where this term appears

Translators see known-good-die in die-level supply agreements, wafer probe data summaries, and multi-die assembly instructions. The abbreviation KGD is common in source text and must be expanded on first use. In quality documents, the term helps distinguish tested bare die from untested die or package-level tested devices.

Translation checks

A common mistake is translating known-good-die as '已知好的芯片' or merging it with good die without the verification nuance. In supply-chain and assembly documents, this can cause confusion about whether testing occurred before shipment. It may also be abbreviated without expansion, leaving readers unsure whether KGD refers to wafer-probe results or package test.

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A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.