A known good die is an unpackaged semiconductor die that has been tested and verified to meet electrical specifications before being assembled into a package or module. In translation and localization, the term appears in procurement specifications, assembly work instructions, quality agreements, multi-chip module design documents, supply-chain traceability records, and documentation for stacked-die or heterogeneous integration projects and final system assembly flows.
Translators see known-good-die in die-level supply agreements, wafer probe data summaries, and multi-die assembly instructions. The abbreviation KGD is common in source text and must be expanded on first use. In quality documents, the term helps distinguish tested bare die from untested die or package-level tested devices.
A common mistake is translating known-good-die as '已知好的芯片' or merging it with good die without the verification nuance. In supply-chain and assembly documents, this can cause confusion about whether testing occurred before shipment. It may also be abbreviated without expansion, leaving readers unsure whether KGD refers to wafer-probe results or package test.
Terminology must stay consistent across datasheets, design kits and patent filings. A single inconsistent parameter can propagate into fabrication decisions or weaken a patent claim, and IP confidentiality applies to every document in the chain.
Angel Translation locks terms like this into a project terminology base before expert review begins, so the same source term resolves to the same target term across every document in a submission — and stays consistent in the next revision. See the 8-step AI + expert workflow.
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