Wafer Probe晶圆探测
Wafer probe is an electrical test performed on individual dies while they are still part of a wafer, using probe cards to contact pads and measure basic device parameters before the wafer is diced. In semiconductor localization, the term appears in manufacturing test flows, wafer-sort programs, yield reports, lot histories, and quality documentation that distinguish wafer-level screening from final package-level testing.
Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.
Check source meaning → confirm the preferred term → record approved variants and references.
Where this term appears
In localization, wafer-probe content appears in production test documentation, yield management reports, lot travelers, and failure analysis records. Translators may encounter the term when localizing data fields such as 'probe yield', 'probe bin', or 'wafer sort result' in MES or ERP interfaces. It also appears in quality manuals that define outgoing wafer acceptance criteria before assembly.
Translation checks
A frequent error is translating wafer-probe as 'wafer inspection' or 'visual inspection', which confuses electrical testing with optical or defect inspection. This matters because probe data drives binning and yield decisions, and the wrong term can make process documentation ambiguous. Another issue is omitting the wafer-level context and translating it simply as 'probe test', which loses the distinction from package-level or bench testing.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
Prepare an inquiry email →Semiconductor solutions →File handling →A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.