Defect Density缺陷密度
Defect density is the number of harmful defects found per unit area of a wafer or die, typically expressed as defects per square centimeter or per die area. In yield and quality documentation, the term appears as a key indicator for comparing fabrication processes, predicting yield loss, deciding whether a wafer lot meets reliability targets, tracking process stability during yield ramp, and setting inspection priorities in a fabrication facility.
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Where this term appears
In localization projects, the term defect density appears in yield reports, process control charts, supplier quality scorecards, and reliability qualification documents. It also occurs in fab management dashboards, defect review meetings, failure analysis summaries, and customer quality communications where defect density trends justify inspection lot changes, tool maintenance, or root-cause investigations.
Translation checks
A frequent mistake is translating it as “defect concentration” or “defect rate,” which can suggest a chemical concentration or a time-based failure rate. This is risky because the meaning relies on area normalization; losing that distinction in yield reports can change pass/fail interpretation and confuse comparisons between wafers or processes.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
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