Wafer sort is the electrical testing and classification of individual dies while they are still on the wafer, before die separation, assembly, and packaging. In manufacturing and test documentation, the term records pass/fail results, bin assignments, and historical data used to identify wafer-level yield patterns, reject bad dies, and decide which known-good dies continue to subsequent assembly and final test.
In localization, wafer sort appears in test program instructions, wafer maps, prober equipment recipes, production lot travelers, and yield management system reports. It also occurs in data-log formats, quality records, and traceability documents where bin codes, probe coordinates, and fail categories are documented for later yield analysis and lot disposition.
A frequent mistake is translating wafer sort as “晶圆分类” or “晶圆分级” in a way that suggests mechanical sorting only, or confusing it with final test after packaging. Since wafer sort is an electrical test step performed on the wafer, the mistranslation can obscure pass/fail data and binning decisions in test reports.
Terminology must stay consistent across datasheets, design kits and patent filings. A single inconsistent parameter can propagate into fabrication decisions or weaken a patent claim, and IP confidentiality applies to every document in the chain.
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