Wafer Sort晶圆分选
Wafer sort is the electrical testing and classification of individual dies while they are still on the wafer, before die separation, assembly, and packaging. In manufacturing and test documentation, the term records pass/fail results, bin assignments, and historical data used to identify wafer-level yield patterns, reject bad dies, and decide which known-good dies continue to subsequent assembly and final test.
Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.
Check source meaning → confirm the preferred term → record approved variants and references.
Where this term appears
In localization, wafer sort appears in test program instructions, wafer maps, prober equipment recipes, production lot travelers, and yield management system reports. It also occurs in data-log formats, quality records, and traceability documents where bin codes, probe coordinates, and fail categories are documented for later yield analysis and lot disposition.
Translation checks
A frequent mistake is translating wafer sort as “晶圆分类” or “晶圆分级” in a way that suggests mechanical sorting only, or confusing it with final test after packaging. Since wafer sort is an electrical test step performed on the wafer, the mistranslation can obscure pass/fail data and binning decisions in test reports.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
Prepare an inquiry email →Semiconductor solutions →File handling →A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.