Binning分档
Binning is the process of sorting tested semiconductor devices into performance classes after wafer test or final test, based on measured parameters such as speed, power, or functional capability. It appears in production test programs, yield reports, and product datasheets, where grade definitions and part-number suffixes are determined by test limits and customer requirements.
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Where this term appears
In localization, binning appears in test engineering documents, product datasheets, and yield management reports. It also occurs in traceability systems and manufacturing execution records where test results are stored by bin code. Translators must distinguish performance binning from visual or mechanical sorting, and keep 'bin' as a test category rather than a physical container.
Translation checks
A frequent error is translating binning as '装箱' or loose '分类,' which suggests packaging or material handling rather than performance grading. Rendering 'bin' as '仓库' also misreads test program output, where each bin is a test result category. In production data, this confuses yield analysis, orderable part numbers, and product traceability.
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Related document experience
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SMIC (Semiconductor Manufacturing International)
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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