Wafer Level Packaging晶圆级封装
Wafer-level packaging is a packaging technology in which die interconnects and protective layers are formed while the dies are still on the wafer, before singulation. In localization and translation, the term appears in package datasheets, process integration documents, equipment manuals, reliability reports, yield reports, and package qualification files that cover redistribution layers, bumps, wafer-level test, final package dimensions, and board-level reliability.
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Where this term appears
Translators encounter wafer-level-packaging in packaging roadmaps, process specifications for redistribution layers, bumping documentation, and equipment user interfaces. It often appears with fan-in and fan-out variants, requiring careful distinction. Localizing defect inspection criteria also demands a clear term that separates wafer-level operations from die-level assembly.
Translation checks
A frequent mistake is treating wafer-level packaging as simply '封装在晶圆上' or rendering it with a word-for-word phrase that obscures the process sequence. This can blur the boundary between frontend wafer processing and backend packaging. In process documents, such ambiguity may cause readers to miss that testing and interconnection occur before die singulation.
Keep the term aligned across your files
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Related document experience
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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