Wafer Thinning晶圆减薄
Wafer thinning is a back-end process that grinds or etches the backside of a semiconductor wafer to reduce its thickness before die singulation and packaging, typically after front-end device fabrication and wafer probe. In localization and translation, the term appears in assembly process flows, packaging specifications, equipment manuals, work instructions for handling thin wafers, and failure analysis reports that discuss stress relief, warpage control, edge chipping, and final package height.
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Where this term appears
Translators encounter wafer thinning in packaging and assembly workflows, especially when localizing instructions for taiko thinning, temporary bonding, and backside grinding. It also appears in quality documents that specify thickness targets and total thickness variation, where a wrong term choice can affect operator understanding of handling limits and breakage risk.
Translation checks
A common error is rendering wafer thinning as '晶圆瘦身' or using vague terms that do not specify backside grinding. This obscures the process step and may confuse it with wafer warpage or planarization. In assembly instructions, such ambiguity can lead to incorrect handling of ultra-thin wafers, increasing breakage, edge chipping, or stress damage.
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Related document experience
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Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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