Wafer Dicing晶圆切割

Where this term appears

In localization, wafer dicing appears in assembly and packaging process flows, dicing equipment manuals, work instructions, and incoming material inspection documents. It also appears in quality and yield reports where die edge damage, chipping, or kerf variation is discussed, especially in content for OSATs and semiconductor assembly sites. The term often occurs with die attach and wafer thinning.

Translation checks

A common error is translating wafer dicing as 'wafer cutting' too literally in every case, missing the standard industry term 'singulation' when referring to the broader separation step. Another issue is using 'scribing' as a synonym for dicing; scribing historically refers to creating a groove or fracture line, not always full separation, so mixing them can change the process meaning.

From reading to a project

Keep separation steps and drawing features distinct

Illustrative review sheet01

Illustrative file reference · invented DEMO documents

File and revision

DEMO-WFR-03 · Wafer map index · Rev B

Named operation

Wafer dicing / singulation · term as written in each source section

Map and figure references

DEMO-MAP-07 · scribe-line label / DEMO-SEC-03 · kerf annotation

Illustrative Chinese reference

晶圆图索引 · DEMO-WFR-03 · B版

Review status: questions to confirm

1. 1

   Use singulation at the right scope

   Check whether “singulation” names the broader separation result or a specific operation in the source. Keep “wafer dicing” where the text explicitly names wafer-level dicing; do not normalize every occurrence to a single word without checking the document context.

2. 2

   Keep scribe line separate from kerf

   In maps and cross-sections, preserve the planned scribe-line region as distinct from kerf, the cut width or removed-material reference. Match each translation to its own drawing callout rather than treating both as a visible line.

3. 3

   Do not turn scribing into completed separation

   Where “scribe” or “scribing” appears, check whether it describes a groove/marking step or full die separation. Preserve the stated action and status; do not silently translate a partial operation as completed dicing.

DISCO on dicing and separation terminology

Related published experience

Torex Semiconductor→

Japanese → Chinese

Japanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.

Related Japanese-to-Chinese semiconductor documentation for Torex. The invented register illustrates file preparation; the public case does not identify this particular process or document set.

For your quotation

List the file revisions and map/drawing references; identify whether each term names an operation, planned region or cut-width field.

Prepare a Chinese semiconductor-file inquiry →

Prepare semiconductor product-document files →Record protected identifiers and wording decisions →

Keep the term aligned across your files

Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.

Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.