Redistribution Layer重布线层
A redistribution layer (RDL) is an additional thin-film metal and dielectric routing layer formed on a die or wafer to reroute I/O pads to new locations for finer pitch, different bump patterns, or package compatibility before bump formation. In localization, the term appears in advanced packaging design documents, wafer-level packaging process specifications, assembly drawings, and DFM guidelines that describe fan-in or fan-out interconnects.
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Where this term appears
Localization teams see redistribution layer in packaging design reviews, wafer-level packaging process flows, and cross-section diagrams. It occurs in strings such as 'RDL first', 'RDL last', 'RDL dielectric', and 'RDL trace width' within process specifications and equipment documentation. Translators must keep the abbreviation RDL stable while adapting the expanded term according to approved terminology.
Translation checks
A common error is translating redistribution layer word-by-word as 're-distribution layer' or 'distribution layer' without conveying the routing function. This creates vague process documentation, especially where RDL is used for pad relocation. Another issue is inconsistent use of the abbreviation and full term: some documents use the localized expanded term after first mention, while others retain 'RDL', making cross-reference between design and process documents harder to follow.
Keep the term aligned across your files
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Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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