Interposer中介层
An interposer is an intermediate layer, often made of silicon or organic material, that sits between a die or multiple dies and the package substrate to provide dense routing, power delivery, and signal connections. In advanced packaging documentation, it appears in package cross-sections, signal integrity discussions, thermal-mechanical design descriptions, assembly process instructions, package substrate design guides, and package qualification reports.
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Where this term appears
Interposer appears in localization of advanced packaging design rules, assembly drawings, substrate supplier documents, failure analysis reports, and reliability assessments. Translators encounter terms like silicon interposer, organic interposer, microbump, and through-silicon via. They need to keep package stack-up names consistent across design, manufacturing, and reliability documents while avoiding PCB terminology.
Translation checks
A common error is translating interposer as 'adapter' or 'intermediate board', which is too vague and can confuse it with a PCB. Another mistake is omitting the function of dense die-to-package routing and focusing only on the layer position; this loses the reason it matters in high-bandwidth packaging and thermal-mechanical design.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
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SMIC (Semiconductor Manufacturing International)
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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