Through-Silicon Via硅通孔
A through-silicon via (TSV) is a vertical interconnect that passes through a silicon die or wafer, creating an electrical path between the front and back sides for stacked-die or package integration. In localization, the term appears in 3D packaging documents, interposer design guides, assembly drawings, and reliability reports that discuss electrical performance, thermal behavior, and mechanical stress in stacked structures.
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Where this term appears
In localization, through-silicon via appears in advanced packaging datasheets, 3D-IC integration guides, and packaging reliability reports. Translators encounter it in phrases like 'TSV middle', 'TSV reveal', and 'TSV liner' in process specifications and failure analysis documents. The abbreviation TSV is usually preserved, while the expanded term may be localized according to client terminology.
Translation checks
A frequent error is translating through-silicon via as 'silicon via' or 'through-hole' without specifying that it passes through the silicon substrate. In PCB documents, 'through-hole' means a plated hole in a circuit board, so reusing that term misleads readers about the structure. Another mistake is expanding TSV inconsistently as 'through-substrate via' or 'through-silicon valve' in automated translation, which breaks terminology databases.
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Related document experience
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