Wafer Bonding晶圆键合
Wafer bonding is the process of joining two semiconductor wafers, often with oxide, adhesive, or metal interface layers, to form a temporary or permanent single mechanical and electrical structure prior to dicing or final packaging. In packaging and MEMS documentation it appears in process specifications, cross-section diagrams, alignment recipes, and reliability reports for stacked devices, sensor caps, and bonded substrates.
Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.
Check source meaning → confirm the preferred term → record approved variants and references.
Where this term appears
Wafer bonding appears in packaging process flows, MEMS fabrication instructions, cross-section labels, and reliability qualification reports. Translators encounter it when localizing equipment recipes, alignment procedures, and failure analysis documents, where bond interface, void, and bond strength terms must stay distinct from wire-bond or die-attach terminology and match image annotations.
Translation checks
A common mistake is translating wafer bonding as chip bonding or wire bonding, which conflates wafer-level joining with die-level interconnect. Another issue is omitting whether the bond is temporary or permanent; that distinction can change the meaning of debonding, alignment, and stack-formation steps in MEMS or 3D packaging flows.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
Prepare an inquiry email →Semiconductor solutions →File handling →A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.