Lithography光刻
Lithography in semiconductor manufacturing is the process of transferring a circuit pattern from a photomask onto a wafer using light and a photosensitive resist. In process documentation, the term appears in fab flow descriptions, lithography equipment manuals, and patterning module discussions, where it encompasses coating, exposure, alignment, resist processing, and subsequent metrology or inspection steps used to confirm pattern quality.
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Where this term appears
'Lithography' appears in process integration papers, fab training materials, equipment operation guides, photoresist or photomask specifications, and litho-cell monitoring documents. Translators encounter it when localizing process step descriptions, defect inspection instructions, and overlay or critical-dimension control text, where it must not be translated as general printing arts or as a generic art term.
Translation checks
A common error is translating 'lithography' as 'lithographic printing' or using the general printmaking sense. In semiconductor texts, that misrepresents a wafer-patterning process and can confuse readers of process flow or equipment safety documentation. Another issue is dropping modifiers incorrectly, such as merging photolithography, EUV lithography, and immersion lithography into one undifferentiated term.
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Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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