Backend后道工序
Backend in semiconductor manufacturing refers to the later production phase after wafer fabrication, encompassing interconnect metallization, wafer probe, assembly, packaging, and final test. The term appears in production flow descriptions, capacity planning documents, cost models, and supply-chain reports where frontend wafer processing and backend assembly/test are tracked as separate phases with distinct equipment sets and cycle times.
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Where this term appears
Backend appears in production flow documentation, packaging specifications, capacity reports, and supply chain communications. Translators encounter it when localizing fab-to-packaging handoff documents, assembly instructions, ERP or MES interface labels, and final test records, where backend must not be confused with software back-end or with a generic post-processing step.
Translation checks
A common mistake is translating backend as software back end or IT back end, which is inappropriate in fab and packaging documents. Another issue is using a vague term such as later process, losing the standard frontend/backend split that capacity, cost, and yield discussions rely on, especially in MES strings and dashboards.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
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