Burn-in老化测试
Burn-in is a reliability stress test that operates semiconductor devices at elevated temperature, voltage, or load for a defined period, accelerating early-life failures and screening out weak parts. It appears in reliability qualification documents, production test procedures, and quality records for high-reliability applications, where fallout data is used to estimate early field failure rates and to set screen limits for production.
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Where this term appears
Burn-in appears in reliability test plans, environmental stress screening procedures, and customer quality agreements. It also occurs in automotive or industrial semiconductor documentation where early-life failure requirements are strict. Translators need to distinguish burn-in from lifecycle aging and endurance testing, and to preserve stress temperature, duration, and bias conditions accurately.
Translation checks
A frequent error is translating burn-in as '烧机' or simply '老化' without retaining the reliability-screen intent; it may sound like routine operating time rather than a defined stress test. Another mistake is confusing burn-in with lifecycle aging or high-temperature operating life testing, which can misstate test conditions, durations, and acceptance criteria in quality documents.
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Related document experience
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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