English–Chinese reference · Semiconductor

Failure Analysis失效分析

Failure analysis is the systematic investigation of a failed device, package, or wafer-level structure to determine the physical, electrical, or environmental cause of failure, using electrical testing, physical inspection, and material characterization. It appears in reliability reports, customer return documentation, yield-improvement projects, and corrective action records, where findings are used to drive design, assembly, or test changes; the term is often shortened to FA.

Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.

TERM REFERENCE · PROJECT CHECK
EnglishFailure Analysis
简体中文失效分析
DomainSemiconductor

Check source meaning → confirm the preferred term → record approved variants and references.

Where this term appears

In localization, failure analysis appears in reliability reports, customer return and complaint records, yield engineering documentation, and corrective action reports. It also appears in lab procedures, analytical tool manuals, and failure-analysis request forms where FA techniques, evidence handling, and root-cause conclusions are described for cross-functional teams. Translators often encounter the abbreviation FA in headings and UI labels.

Translation checks

A common mistake is translating failure analysis as 'fault analysis' or 'error analysis' in all contexts, which can blur the distinction between systematic physical diagnosis and software debugging. Another error is expanding FA incorrectly in headings or UI strings, for example as 'factory automation' or 'final assembly,' leading to serious confusion in reports.

Keep the term aligned across your files

Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.

Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.

Working on semiconductor documentation?

Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.

Prepare an inquiry email →Semiconductor solutions →File handling →

A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.