CMP化学机械抛光
CMP, or chemical mechanical planarization, is a process that flattens wafer surfaces by combining chemical slurry with mechanical abrasion. In semiconductor documentation, the term appears in planarization process steps, slurry and pad specifications, CMP tool manuals, and defect inspection reports, where removal rate, uniformity, and endpoint detection are tracked because they affect subsequent lithography and yield and final device performance.
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Where this term appears
In localization, CMP appears in process flow descriptions, equipment messages, and materials documentation for slurry and pads. It also occurs in defect and yield review documents, where a clear distinction between planarization and ordinary polishing is needed to preserve process meaning and root-cause context, especially in translated quality reports and maintenance alerts. The distinction also matters in root-cause discussions.
Translation checks
A common mistake is to translate CMP as ordinary “polishing” and drop the chemical-planarization meaning. This can misrepresent the process as purely mechanical, causing confusion in slurry handling, endpoint control, and defect investigations where chemical selectivity and surface planarity are key factors. The loss of this nuance affects process control and quality documents.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
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