Metallization金属化
Metallization is the deposition and patterning of metal layers that form a chip’s interconnects, connecting transistors to each other and to bond pads, and it also refers to the resulting metal film stack. In semiconductor documentation it appears in process-flow descriptions, cross-section diagrams, design-rule manuals, and material specifications where layer names, materials, thickness values, and linewidths are defined.
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Where this term appears
Metallization appears in wafer-fab process specifications, design-rule documents, cross-section labels, and failure-analysis reports. In localization, it occurs when translating layer stack tables, deposition and etch recipes, or material declarations, where the names of metal levels, barrier films, and contact structures must stay consistent with tool data and drawings.
Translation checks
A frequent error is translating metallization as metal plating or a generic metal coating, which misrepresents the patterned interconnect process. Another issue is collapsing distinct metal levels into one vague term, creating ambiguity in design rules and process instructions where lower and top metal layers have different thickness or current limits.
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Related document experience
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SMIC (Semiconductor Manufacturing International)
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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