Hybrid bonding joins dielectric surfaces and forms direct electrical connections between aligned metal contacts.
Updated
Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.
Check source meaning → confirm the preferred term → record approved variants and references.
In a packaging cross-section, label the dielectric interface and metal contacts separately. Preserve whether the bonding is performed at wafer-to-wafer or die-to-wafer level when the source specifies it. Use the reported pitch and alignment criteria as written, with their units and applicable interface.
Keep the dielectric interface and direct metal contacts identifiable in both the callouts and the text. State whether the source describes wafer-to-wafer or die-to-wafer assembly. Preserve whether a value applies to interconnect pitch, alignment error or a different feature, and keep the original units.
Preparing a semiconductor file set for Chinese readers? Prepare terminology and document references →
Chinese document application
Illustrative wording only. Confirm the rendering against the actual source and approved project terminology.
Keep each label associated with its own arrow. Retain material names such as Cu or SiCN if specified. Match the pitch label to its dimension line.
Compare the Chinese labels, figure references and units against the same source revision.
Provide editable annotations, the controlled figure, its caption and an owner for questions about the cross-section.
imec · Wafer-to-wafer hybrid bonding
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Japanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →Corporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
Prepare an inquiry email →Semiconductor solutions →File handling →A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.