English–Chinese reference · Semiconductor

Hybrid Bonding混合键合

Hybrid bonding joins dielectric surfaces and forms direct electrical connections between aligned metal contacts.

Updated

Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.

TERM REFERENCE · PROJECT CHECK
EnglishHybrid Bonding
Chinese (Simplified)混合键合
DomainSemiconductor

Check source meaning → confirm the preferred term → record approved variants and references.

Where this term appears

In a packaging cross-section, label the dielectric interface and metal contacts separately. Preserve whether the bonding is performed at wafer-to-wafer or die-to-wafer level when the source specifies it. Use the reported pitch and alignment criteria as written, with their units and applicable interface.

Translation checks

Keep the dielectric interface and direct metal contacts identifiable in both the callouts and the text. State whether the source describes wafer-to-wafer or die-to-wafer assembly. Preserve whether a value applies to interconnect pitch, alignment error or a different feature, and keep the original units.

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Chinese document application

Hybrid Bonding in context · cross-section figure annotations

Self-created translation example
English source
A: Bonded dielectric interface · B: Metal contacts · C: Interconnect pitch
Chinese rendering to review
A:介质键合界面 · B:金属接触点 · C:互连节距

Illustrative wording only. Confirm the rendering against the actual source and approved project terminology.

Check the distinction in context

Keep each label associated with its own arrow. Retain material names such as Cu or SiCN if specified. Match the pitch label to its dimension line.

Check the returned Chinese file

Compare the Chinese labels, figure references and units against the same source revision.

Prepare the connected files

Provide editable annotations, the controlled figure, its caption and an owner for questions about the cross-section.

Keep the term aligned across your files

imec · Wafer-to-wafer hybrid bonding

Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.

Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.

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Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.

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A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.