Passivation钝化
Passivation is a protective dielectric layer, commonly silicon nitride or silicon dioxide, deposited over a completed circuit to block moisture, mobile ions, and mechanical damage. In semiconductor documentation, the term appears in final-stage wafer fabrication process flows, layer stack tables, design-rule files, and reliability reports; these documents specify bond-pad openings, top-layer coverage, and film thickness limits that affect packaging and probing.
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Where this term appears
Passivation appears in process flow documents, layer stack records, packaging specifications, and failure analysis reports that discuss corrosion or pad contamination. It also occurs in EDA design-rule documentation where passivation openings for bond pads are defined. Translators should keep the term distinct from chemical surface treatments used in other industries and from generic insulation.
Translation checks
A recurring error is translating passivation as 'passivization' or using a chemistry term that suggests cleaning, neutralization, or surface treatment rather than a deposited protective film. In semiconductor texts this confuses a physical dielectric layer with a chemical process. It may also be rendered as generic insulation, which hides the reliability function and the design rules for pad openings.
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