Sputtering溅射
Sputtering is a physical vapor deposition method in which energetic ions bombard a solid target, ejecting atoms that then condense onto the wafer as a thin film. It appears in semiconductor documentation for metallization and barrier-layer deposition, including process specifications, PVD equipment manuals, and film quality records, where target material, substrate temperature, and deposition conditions such as pressure, power, and gas flow are defined.
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Where this term appears
In localization, sputtering commonly appears in PVD equipment operating manuals, process traveler instructions, and film deposition specifications. It is also found in supplier datasheets for sputter targets and in failure analysis reports that examine thin-film adhesion or thickness. Translators need to distinguish sputter deposition from etch sputtering and from evaporation or CVD to keep tool procedures accurate.
Translation checks
A common mistake is translating sputtering as 'spraying' or 'splashing,' because the everyday word suggests liquid droplets rather than atomic-level ejection. That creates confusion in process instructions and can hide the difference between PVD and other deposition routes. It is also wrong to use the same term for etch sputtering in tool documentation without clarifying the direction of material removal.
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Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
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Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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