Annealing退火
Annealing is a controlled heat treatment in semiconductor manufacturing that repairs crystal damage, activates implanted dopants, and reduces film stress after processes such as ion implantation or etching. The term appears in wafer fabrication documentation, especially in process flow descriptions, thermal budget tables, and equipment recipes, where the thermal cycle, ramp rate, and ambient gases are specified.
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Where this term appears
In translation and localization work, annealing appears in fab process specifications, RTP tool manuals, and safety documentation for thermal processing gases. It also occurs in patent filings and technical articles that describe dopant activation or film-stress relief. Translators must keep the term aligned with related steps such as ion implantation and doping so that process instructions remain unambiguous for engineers and technicians.
Translation checks
A frequent error is translating annealing as a generic heat treatment or as metal tempering, without preserving the distinction between rapid thermal anneal and furnace anneal. This blurs process intent in manufacturing instructions and can cause readers to confuse front-end dopant activation with back-end assembly heating steps. Such ambiguity is costly because the exact thermal cycle affects device performance.
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