Atomic Layer Deposition原子层沉积
Atomic layer deposition (ALD) is a thin-film growth technique that deposits materials one atomic layer at a time by pulsing precursors alternately and relying on self-limiting surface reactions. In advanced semiconductor process documentation, ALD is used for highly conformal films—especially gate dielectrics, liner layers, and high-aspect-ratio structures—where sub-nanometer thickness control and uniformity are critical.
Angel Translation editorial reference · Confirm the rendering against your source and approved project terminology.
Check source meaning → confirm the preferred term → record approved variants and references.
Where this term appears
ALD appears in process integration documents, ALD equipment manuals, and materials qualification reports. Translators handle precursor pulse and purge step labels, cycle count fields, chamber temperature settings, and film thickness tables, often in sections that compare ALD with CVD and PVD. Precise layer-count and pulse-purge terminology directly affects recipe readability.
Translation checks
A common mistranslation is rendering ALD as '原子沉积' and dropping 'layer', which hides the layer-by-layer mechanism. Another error is using '原子级沉积' without explaining that each cycle deposits a single atomic layer, making it sound like any nanoscale deposition. This weakens the distinction from CVD and confuses process control discussions.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
Working on semiconductor documentation?
Include the source and target languages, file types, intended use, deadline and any approved termbase. Agree handling before sending sensitive files. Acknowledged in 4 hours, quoted in 24.
Prepare an inquiry email →Semiconductor solutions →File handling →A glossary entry is not an official standard or evidence of regulatory acceptance. Confirm current requirements for your project separately.