Kerf切割道宽度
Kerf is the width of material removed from a wafer when it is diced, determined by the saw blade or laser beam and often including chipping or damage zones at the edges. In semiconductor localization, the term appears in dicing process specifications, die size calculations, equipment manuals, and yield documentation where die per wafer, cutting edge quality, and chipping allowances are discussed.
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Where this term appears
Translators encounter kerf in dicing saw recipes, wafer layout spreadsheets, and process change notices. It often appears next to scribe-line and blade width, so maintaining distinct terms is important. In yield modeling documents, kerf loss directly affects gross die counts, and translating it as a generic cut gap can distort the calculation.
Translation checks
A frequent mistake is treating kerf and scribe-line as synonyms because both relate to dicing paths. Scribe-line is the planned spacing; kerf is the actual material removed. In die count calculations, choosing the wrong term can change the estimated number of dies per wafer and mislead yield or cost projections.
Keep the term aligned across your files
Technical terms need checking against the source, approved product terminology and related specifications. Keep units, parameter conditions and document versions aligned across the file set.
Provide approved terms and previous translations with the source files. Agree how variants, ambiguous wording and revisions will be reviewed. Terminology maintenance and any termbase handback are confirmed in the project scope. See the 8-step AI + expert workflow.
Related document experience
Torex Semiconductor
Japanese → ChineseJapanese-to-Chinese documentation for a listed Japanese semiconductor manufacturer.
Read the published project →
SMIC (Semiconductor Manufacturing International)
English ⇄ ChineseCorporate reporting and disclosure documentation, delivered across successive annual cycles.
Read the published project →Published scope shows related industry experience; it does not confirm that this specific term was used or reviewed in the project.
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